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AMD Ryzen AI 9 HX 370: Preliminary Benchmark Details
High Performance and Energy Efficiency in Preliminary Tests for the New Mobile AMD CPUs
DukeRem23 July 2024

AMD Ryzen AI 9 HX 370: Leaked Benchmark Reveals Impressive Performance

Highlights:

  • Leaked Benchmark: Details emerge from preliminary tests, showing high performance.
  • Technical Specifications: 12 cores, 24 threads, boost frequency up to 5.1 GHz.
  • Superior Performance: Significantly surpasses previous models and competitors.
  • Energy Efficiency: 28 W power consumption with configurable TDP between 15 and 54 W.

Technical details and the outstanding performance of the AMD Ryzen AI 9 HX 370 have emerged through a leaked benchmark, providing an in-depth look at this yet-to-be-released processor.

The AMD Ryzen AI 9 HX 370, part of the Ryzen AI 300 "Strix Point" family, has shown excellent performance in preliminary benchmark tests. This 12-core, 24-thread processor combines four Zen 5 cores and eight Zen 5C cores, operating at a maximum boost frequency of 5.1 GHz. With a total cache of 36 MB (24 MB L3 and 12 MB L2) and an integrated Radeon 890M GPU with 16 compute units (1024 cores), this chip represents a significant improvement over previous models like the Ryzen 9 8945HS.

Benchmark tests conducted on the Geekbench 6 platform revealed that the Ryzen AI 9 HX 370 scored 2913 points in single-core tests and 15,044 points in multi-core tests, surpassing both its predecessors and current Intel competitors. These results were obtained on an ASUS ProArt P16 laptop, configured with 64 GB of LPDDR5-7467 MT/s memory. The processor demonstrated a maximum frequency of 5145 MHz, slightly above its official 5.1 GHz boost clock.

Technical details of the Ryzen AI 9 HX 370 indicate a power consumption of 28 W (TDP configurable between 15 and 54 W), making it energy-efficient while maintaining high performance. The processor supports various ISA extensions, including SSE4a, SSE4.1, SSE4.2, FMA3, AVX2, and AVX512, and offers advanced virtualization (AMD-V, SVM) and encryption (AES-NI) capabilities.

The following table lists some technical details of the processor:

Technical Specifications Details
Architecture Zen 5 / Zen 5C
Cores / Threads 12 / 24
Base / Boost Frequency 2.0 / 5.1 GHz
Total Cache 36 MB (24 MB L3 + 12 MB L2)
AI Capabilities 80 AI TOPs (50 TOPS NPU)
Integrated GPU Radeon 890M (16 CU at 2.9 GHz)
TDP 28W (cTDP 15-54W)
Manufacturing Process 4 nm
Expected Release Date Q2 2024
Supported OS Windows 10, Windows 11, Linux

 

These results indicate that the AMD Ryzen AI 9 HX 370 is one of the most powerful mobile CPUs currently tested, far surpassing the Ryzen 9 8945HS and even the Intel Core i9-14900HX in many tests. Additionally, the chip shows significant improvements in multi-threaded performance, making it ideal for applications requiring a high level of parallelism.