Huawei points to 3 Nm chips: new strategies to overcome technological limits | Gpu vs cpu performance comparison | List of hardware components and their functions | Cpu hardware examples | Turtles AI

Huawei and Smic are working on the development of 3 Nm chips using alternative technologies such as Duv lithography and self -employed quadruple patterning (SAQP), aiming to overcome the technological restrictions imposed by penalties and to achieve self -sufficiency in the production of advanced semiconductors.

Key points:

• Huawei and Smic collaborate in the development of 3 Nm chips using alternative technologies.
• The adoption of the self -employed quadruple patterning (SAQP) aims to compensate the lack of access to EUV lithography.
• China invests in alternative materials such as carbon nanotubes to improve chip performance.
• International restrictions push Huawei to look for innovative solutions to maintain competitiveness.

Huawei, in collaboration with SMIC, is intensifying the efforts to develop 3 -nanometers chips, facing the limitations imposed by international sanctions that prevent access to advanced lithography technologies such as EUV. To overcome these obstacles, the two companies are adopting the self -employed quadruple patterning (SAQP), a technique that allows you to increase the density of transistors using Duv lithography machinery already available. This strategy, although it involves significant challenges in terms of production costs and complexity, represents an important step towards China’s technological self -sufficiency in the semiconductor sector. At the same time, Huawei is exploring the use of alternative materials such as carbon nanotubes, which offer advantages in terms of speed and energy consumption compared to traditional silicon.

These efforts are part of a wider context of investments and innovations aimed at reducing dependence on western technologies and strengthening China’s position in the global market of advanced chips.