TSMC Announces A14 Node: 1.4nm Production Expected by 2028 | Hardware and software of computer | Gpu hardware laptop | Computer hardware | Turtles AI

TSMC has announced the start of production of the 1.4nm A14 node by 2028, promising significant improvements in efficiency and performance. In parallel, the company is developing advanced packaging technologies to meet the growing demands of AI and chip integration.

Key points:

• 1.4nm A14 node: Expected in 2028, it will offer 15% higher performance or 30% lower power consumption than the N2 node.
• GAAFET technology: The A14 node will use second- or third-generation Gate-All-Around FET transistors, similar to those of the N2 node.
• Advanced packaging: TSMC introduces "System on Wafer-X", capable of integrating at least 16 large-scale chips with memory and optical interconnects.
• Competition and roadmap: Samsung cancels its 1.4nm process but targets 1nm node by 2029, while TSMC maintains leadership with clear plans through 2028.

Taiwan Semiconductor Manufacturing Company (TSMC) announced that its 1.4nm manufacturing node, dubbed A14, will enter mass production in 2028. This process promises a 15% performance boost or 30% power consumption reduction compared to the N2 node scheduled for 2025. The A14 node will use second- or third-generation Gate-All-Around FET (GAAFET) transistors, similar to those of the N2 node, but will not adopt Complementary FET (CFET) technology in its initial phase. In parallel, TSMC is developing its “System on Wafer-X” technology, which enables the integration of at least 16 large chips, along with memory and optical interconnects, in a single high-performance package, ideal for advanced AI applications. As TSMC moves forward with its plan, Samsung has canceled its 1.4nm process for undisclosed reasons, instead focusing on the development of a 1nm node scheduled for 2029. TSMC continues to expand its manufacturing capacity, with plans to build two new factories in Arizona dedicated to advanced chip assembly. The adoption of high numerical aperture EUV (High-NA EUV) lithography for the A14 node is still being evaluated, given the technical challenges associated with reducing mask size.

With these developments, TSMC aims to consolidate its leadership position in the semiconductor industry, offering advanced solutions to meet the growing needs for performance and energy efficiency.