TSMC Accelerates SoIC Packaging Production to Meet Market Demand | Gpu hardware for gaming | Nvidia hardware | Hardware | Turtles AI

TSMC plans to ramp up production of its advanced System-on-Integrated Chip (SoIC) packaging by the end of 2025, aiming to meet the growing demand for high-performance solutions in the semiconductor industry. The innovative packaging enables the vertical integration of multiple chiplets into a single package, providing greater design flexibility and optimization for specific applications.

Key Points:

• TSMC will ramp up production of the SoIC packaging by the end of 2025.
• NVIDIA will adopt the SoIC for its Rubin AI architecture.
• Apple plans to use the SoIC in its M5 chip for AI applications.
• Demand for the SoIC is expected to grow, with production expected to reach 20,000 wafers per month by the end of 2025.

As part of the Rubin architecture, NVIDIA will introduce Rubin R100 GPUs, featuring a 4x lattice design and built using TSMC’s CoWoS-L packaging technology on the N3 process node. These GPUs will be integrated with HBM4E memory, offering significantly higher performance than previous architectures.

In parallel, Apple is developing its M5 chip, aimed at devices such as iPad and MacBook. This chip is expected to use SoIC packaging, integrating components such as the CPU, memory, and I/O into a single die, thus optimizing performance and power efficiency. This move underscores Apple’s commitment to adopting advanced technologies to support the growing needs of AI applications.

To meet growing demand, TSMC plans to triple its production capacity of SoIC products in 2025, from about 2,000 wafers per month to 6,000 by the end of the year. However, demand may outstrip supply, with forecasts indicating the need to reach up to 20,000 wafers per month by the end of 2025.

The growing adoption of SoIC packaging by leading companies such as NVIDIA and Apple highlights the importance of this technology in meeting the needs of modern applications, particularly in the field of AI. TSMC, recognizing the potential of SoIC, is investing significantly to expand its production capacity and consolidate its position as a leader in the advanced semiconductor market.

As technology needs evolve and AI applications expand, the role of SoIC packaging becomes increasingly crucial in determining the performance and efficiency of next-generation electronic devices.